WINPAC Inc
097800
Company Profile
Business description
WINPAC Inc manufactures semiconductor and related solid-state devices. It offers outsourcing production services for semiconductor packaging and testing. The Company's package products include fine pitch ball grid array (FBAG), land grid array (LGA), package on package (POP) and flip chip. It also provides water level package solutions for image sensor/memory/logic applications.
Contact
351-25 Gachang-Ri
Baegam-Myeon
Cheoin-gu
YonginGyeonggi-do449862
KORT: +82 313233191
Sector
Technology
Stock type
Sensitive
Industry
Semiconductors
Fiscal Year End
31 December 2026
Employees
307
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