WINPAC Inc

097800

Company Profile

  • Business description

    WINPAC Inc manufactures semiconductor and related solid-state devices. It offers outsourcing production services for semiconductor packaging and testing. The Company's package products include fine pitch ball grid array (FBAG), land grid array (LGA), package on package (POP) and flip chip. It also provides water level package solutions for image sensor/memory/logic applications.

  • Contact

    351-25 Gachang-Ri
    Baegam-Myeon
    Cheoin-gu
    YonginGyeonggi-do449862
    KOR

    T: +82 313233191

    http://winpac.co.kr

  • Sector

    Technology

    Stock type

    Sensitive

  • Industry

    Semiconductors

    Fiscal Year End

    31 December 2025

    Employees

    307

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