Disco Corp

Company Profile

• Business description

  Disco is a Japan-based semiconductor production equipment manufacturer. Founded in 1937, the company manufactures diamond, water, and laser saws, as well as grinders and polishers, used mainly in back-end processes of semiconductor manufacturing, which involves treating processed silicon during the front-end process by thinning and dicing the wafers into bare dies for packaging.It is the world’s largest manufacturer of semiconductor-grade saws and grinders, with an estimated 60%-70% market share in the semiconductor dicing and grinding industry as of 2025. The company operates three main factories, all located in Hiroshima and Nagano, Japan.

• Contact

  2-13-11 Omorikita
  Ota-ku
  Tokyo143-8580
  JPN

  T: +81 345901111

  https://www.disco.co.jp

• Sector

  Technology

  Stock type

  Sensitive

• Industry

  Semiconductor Equipment & Materials

  Fiscal Year End

  31 March 2027

  Employees

  7,025